Buy 1802.TW by Apr 26, 2026.

The market is currently fixated on the GPU (Nvidia) and the HBM (SK Hynix/Micron), ignoring a critical bottleneck in the advanced packaging layer. Entire AI supply chain, from Blackwell to Apple’s M series is currently being choked by a specific type of fiberglass fabric that basically only one Japanese company knows how to make properly. And they are sold out until 2027. The general assumption is that an H100/Blackwell GPU is just silicon, but the chip sits on a substrate …