China to Double Memory Production Capacity for AI, Influencing the Global Market

**Massive Capacity Surges:** CXMT, China's largest DRAM maker, is projected to ramp up its wafer production significantly. Plans target expanding output from approximately 350,000 wafers per month up to 500,000 wafers over the next two years. Similarly, YMTC is expanding capacity, dedicating a significant portion of its newest fab (Fab 3 in Wuhan) to DRAM production

**Global Procurement Shifts:** With international memory makers redirecting up to 30% of their production toward high-margin High Bandwidth Memory (HBM) to serve massive AI servers, major tech companies are looking to Chinese suppliers to stabilize their supply chains for consumer tech, automotive systems, and other electronics.

https://www.nikkei.com/article/DGXZQOGM039EF0T00C26A6000000/?n\_cid=SNSTW001\&n\_tw=1783410922